Product Introduction
Laminated busbars, also known as composite busbars, laminated non-inductive busbars, laminated busbars, sandwich busbars, low-inductive busbars, electronic busbars, and build-up busbars, are a type of multi-layer composite structural connection busbar. Compared with traditional heavy and disorganized wiring methods, they feature low impedance, anti-interference, high reliability, space-saving, and quick assembly.
They are widely used in rail transit, wind and solar inverters, industrial frequency converters, large UPS systems, or other components requiring power distribution.
Laminated busbars are multi-layer composite structural circuits formed by stacking multiple layers of conductive materials and insulating materials. As a type of multi-layer composite structural connection busbar, they reduce the distributed inductance of the circuit through the structural form of parallel distribution of positive and negative plates in a laminated manner. This reduces the surge voltage when power components are turned off and the voltage resistance requirements of power components, improves the reliability and stability of power device operation, and at the same time enhances the integration of the circuit.
Product Features:
A. Low inductance coefficient, compact structure, which effectively saves internal installation space, increases heat dissipation area, and effectively controls the system temperature rise;B. Minimal impedance, which reduces line losses and significantly improves the large current-carrying capacity of the circuit;C. Reduces the damage to components caused by voltage commutation spikes, extending (improving) the service life of electronic components;D. Reduces system noise, electromagnetic interference (EMI), and radio frequency interference (RFI);E. A high-power modular connection structural component with features such as simple and quick assembly.
A laminated busbar is made by stacking two or more layers of copper busbars, with electrical insulation between each copper layer using insulating materials. The conductive layers and insulating layers are pressed into an integrated unit through relevant processes.
The connecting wires are designed with a flat cross-section. Under the same current cross-sectional area, this design increases the surface area of the conductive layers; at the same time, the distance between the conductive layers is significantly reduced. Due to the proximity effect, adjacent conductive layers carry currents in opposite directions, and the magnetic fields they generate cancel each other out—this significantly reduces the distributed inductance in the circuit. Additionally, its flat shape greatly increases the heat dissipation area, which is conducive to improving its current-carrying capacity.
Advantages of Laminated Busbars
- Compact structure, which makes effective use of space and enables system temperature control;
- Reduces the number of components, enhancing system reliability;
- Facilitates installation and maintenance;
- Features a concise and aesthetically pleasing design;
Ordinary Copper Busbar Connection Laminated Busbar Connection
Original Installation & Laminated Busbar
Traditional Cables Laminated Busbars
Conductor Selection
The price of a laminated busbar is determined by the material of its conductor. To meet a series of environmental and electrical performance requirements, users can make the optimal selection based on actual applications.
| Material Type | Tensile Strength | Elongation | Volume Resistivity | Price |
|---|---|---|---|---|
| Cu-T2 | 196MPa | 30% | 0.01724Ω·mm²/m | Medium |
| Cu-TU1 | 196MPa | 35% | 0.01750Ω·mm²/m | High |
| Cu-TU2 | 275MPa | 38% | 0.01777Ω·mm²/m | High |
| Al-1060 | — | — | — | Low |
The Influence of the DC Bus Insulation Layer is as Follows:
- The thickness of the insulation layer is of great importance;
- The thickness of the insulation layer acts as a function of additional stray inductance;
- The thickness of the insulation layer acts as a function of partial discharge in the additional high-frequency capacitor.
The inductance of the bus is proportional to the thickness of the insulating material between the busbar layers.
Product details
Product Parameters
| Item | Description |
|---|---|
| Working Voltage | 0~20kV |
| Rated Current | 0~3600A |
| Product Structure | Heat-sealed edge, heat-pressed non-sealed edge, heat-pressed potting |
| Maximum Processing Size | 900~1900MM |
| Flame Retardant Grade | UL94 V-0 |
| Conductor Material | T2Cu, 1060 AL |
| Conductor Surface Treatment | Passivation, Tin Plating, Nickel Plating, Silver Plating |
| Connection Method with Components | Convex Pressing, Copper Column Riveting, Copper Column Welding |
| Insulation Resistance | 20MΩ~ ∞ |
| Partial Discharge | Less than 10PC |
| Temperature Rise | 0~30K |